JSOL CAE Forum 2019
JSOL Corporation is holding the “JSOL CAE Forum” to provide our users with the latest and most comprehensive simulation technologies and case studies for various JSOL CAE packages including LS-DYNA.
Until last year, we had held user's events individually for each package, like LS-DYNA & JSTAMP Forum, J-OCTA Users Conference, and Moldex3D technology exchange. In 2019, we decided to hold a comprehensive and unified event called “JSOL CAE Forum” at Shinagawa, Tokyo, from November 6 through 8. During the three-day event we will showcase a wide range of information to our structural, manufacturing, and material CAE package users all together.
We will start accepting applications in late September. A detailed program will be published on this page around the same time.
We encourage our users to take advantage of this opportunity and look forward to your attendance at the event.
JSOL Corporation
Engineering Technology Division
Overview
- Title:
- JSOL CAE Forum 2019
- Dates:
Wed, November 6, 2019 J-OCTA, Moldex3D Thu, November 7, 2019 LS-DYNA, JSTAMP, Digimat, Simpleware Software, SIESTA Fri, November 8, 2019 JSTAMP, AFDEX, Virfac, LS-DYNA - Organizer:
- JSOL Corporation
- Venue:
- Tokyo Conference Center Shinagawa
1-9-36 Konan Minato-ku Tokyo Japan - Contents:
- Conference / Partner exhibition / JSOL poster sessions
- Registration Fee:
- Users : Free
Non-subscribed users : 50,000.-JPY (exc.tax)
* Submissions from competitors or intended for sales purposes will not be accepted.
Pickup Sessions
Special Speech
- LS-DYNA：Special Speech
- 11/7 Thursday
- 30 years of car crash simulation at Toyota
- Dr. Yasuki, Tsuyoshi
- Project general manager
Advanced R&D and Engineering Company, Advanced Vehicle Engineering Development Div. - Toyota Motor Corporation
Keynote Speech & General Session
Structure
- LS-DYNA：Keynote Speech
- 11/7 Thursday
- Can Academics in Structural Mechanics Survive? ~ Mechanical Viewpoint and Creativity ~
- Dr. Aoki, Takahira
- Professor
Department of Aeronautics and Astronautics, Graduate School of Engineering - University of Tokyo
- LS-DYNA：General Session
- 11/7 Thursday
- Recent Development in LS-DYNA
- Dr. Jason Wang
- Livermore Software Technology Corporation
- ANSYS Simulation and Strategy
- Dr. Larry Williams
- Director of Technology
Mechanical, Fluids, and Electronics Business Unit - ANSYS
Manufacturing
- JSTAMP：Keynote Speech
- 11/8 Friday
- Material modeling methods for high-precision sheet metal forming simulations
- Dr. Kuwabara, Toshihiko
- Distinguished Professor
Division of Advanced Mechanical Systems Engineering, Institute of Engineering - Tokyo University of Agriculture and Technology
- AFDEX
- 11/8 Friday
- Key points of plate forging
- Prof. Wang Zhigang
- Faculty of Engineering
- Gifu University
Material
- J-OCTA：Keynote Speech
- 11/6 Wednesday
- Computing Material Properties with SIESTA
- SIESTA：Keynote Speech
- 11/7 Thursday
- Computing Material Properties with SIESTA, Case Studies and New Features under Development
- Prof. Pablo Ordejón
- CSIC Research Professor
- Catalan Institute of Nanoscience and Nanotechnology
- J-OCTA：Keynote Speech
- 11/6 Wednesday
- All-atom Molecular Dynamics Study of Impact Fracture
- Dr. Fujimoto, Kazushi
- Assistant Professor
Department of Materials Chemistry, Graduate School of Engineering - Nagoya University
- Digimat：Keynote Speech
- 11/7 Thursday
- Molecular Simulation in Composite Matertials
- Associate Prof. Koyanagi, Jun
- Department of Materials Science and Technology
- Tokyo University of Science
- SIESTA：Keynote Speech
- 11/7 Thursday
- Materials science research by first-principles electronic structure calculation
- Dr. Nara, Jun
- Senior researcher, International Center for Materials Nanoarchitectonics (MANA)
- National Institute for Materials Science
Convergence Engineering
- Simpleware Software
- 11/7 Thursday
- Overseas case studies, and new ways of automating workflows
- Dr. Kerim Genc
- Synopsys Inc
JSOL Partners
Contact
Users Meeting Secretariat
JSOL Corporation, Engineering Technology Division
E-mail : event@sci.jsol.co.jp
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