JSOL Corporation is holding the “JSOL CAE Forum” to provide our users with the latest and most comprehensive simulation technologies and case studies for various JSOL CAE packages including LS-DYNA.
Until last year, we had held user's events individually for each package, like LS-DYNA & JSTAMP Forum, J-OCTA Users Conference, and Moldex3D technology exchange. In 2019, we decided to hold a comprehensive and unified event called “JSOL CAE Forum” at Shinagawa, Tokyo, from November 6 through 8. During the three-day event we will showcase a wide range of information to our structural, manufacturing, and material CAE package users all together.
We will start accepting applications in late September. A detailed program will be published on this page around the same time.
We encourage our users to take advantage of this opportunity and look forward to your attendance at the event.
JSOL Corporation
Engineering Technology Division
Wed, | November 6, 2019 J-OCTA, Moldex3D |
Thu, | November 7, 2019 LS-DYNA, JSTAMP, Digimat, Simpleware Software, SIESTA |
Fri, | November 8, 2019 JSTAMP, AFDEX, Virfac, LS-DYNA |
* Submissions from competitors or intended for sales purposes will not be accepted.
Users' Conference Secretariat
Engineering Technology Business Unit, JSOL Corporation
E-mail : hg-event@s1.jsol.co.jp