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Seminars and Events

Seminars and Events

LS-DYNA & JSTAMP Forum 2013

Outline of LS-DYNA & Forum 2013

Organizer: JSOL Corporation
Dates: Wednesday, July 24 - Friday, July 26, 2013
Venue: Tokyo Conference Center Shinagawa (Tokyo, Japan)
URL: http://www.tokyo-cc.co.jp/eng/access.html [map]
Expected number of participants: Approximately 400

Program

Day1 : Wednesday, July 24, 2013

9:00
|
Registration
9:30
|
9:40
Opening
9:40
|
10:25
General Session 1
Kl-01
[Keynote Speech]
Towards Including Virtual Testing Procedure into the Homologation Process - Experiences within the EU-Project IMVITER
Dr. Thomas Munz, DYNAmore GmbH
10:25
|
12:00
Automotive Session Integrated solutions Session Manufacturing Session 1
MO-01
10:35-11:05
Numerical Simulation of Vehicle's Rollover Behavior by using LS-DYNA
Mr. Tatsuya Fukushima, NISSAN Motor Co., Ltd.
MO-02
11:10-11:40
Side Airbag deployment through a seat tear seam rupture in LS-DYNA
Mr. Kazuo Imura, HONDA R&D Co., Ltd.
MO-03
11:45-12:15
Implementing advanced FE modeling in the newly updated Hybrid-III crash test dummy
Dr. Intaek Lee, Humanetics Innovative Solutions Japan
SO-01
10:35-11:05
Digimat-CAE/LS-DYNA application for full vehicle crush
Mr. Noriyo Ichinose, JSOL Corporation
SO-02
11:10-11:40
Product development & Human resource development with CAE in LION Corporation
Mr. Nobuhito Nakagawa, LION Corporation
SO-03
11:45-12:15
Comparison of internal fixations for distal clavicular fractures based on loading tests and finite element analyses
Ms. Rina Sakai, Kitasato University
P1-01
10:35-11:05
TBA
Mr. Sou Suzuki, G-TEKT CORPORATION
P1-02
11:10-11:40
Stamping simulation techniques for high strength steel sheets
Dr. Tohru Yoshida, Nippon Steel & Sumitomo Metal Corporation
P1-03
11:45-12:15
Technology of formability prediction in hot stamping simulation
- Effect of deformation property and friction property in high temperature and for hot stamping formability -
Mr. Masahiro Nakata, Nippon Steel & Sumitomo Metal Corporation
12:00
|
13:00
Lunch
13:30
|
15:10
New technologies Session Material Session Manufacturing Session 2
NT-01
13:30-14:00
Simulation and Innovation
Dr. Masataka Koishi, The Yokohama Rubber Co.,Ltd.
NT-02
14:05-14:35
DIFFCRASH analysis of airbag scatter in crash simulation
Dipl.-Math. Clemens-August Thole, SIDACT GmbH
NT-03
14:40-15:10
A Statistical Analysis of Arm Kinematics Effect on Occupant Dummy Chest Deceleration on Passenger Side in Frontal Impacts
Mr. Tatsuya Komamura, TOYOTA MOTOR CORPORATION
MA-01
13:30-14:00
Material Testing, Modeling and Validation Techniques for MAT_SAMP-1
Dr. Kunio Takekoshi, TERRABYTE Co., Ltd.
MA-02
14:05-14:35
Evaluation of mechanical properties of weldline by cooperation with Moldex3D and DIGIMAT
Mr. Takato Nakayama, JSOL Corporation
MA-03
14:40-15:10
Experimental measurement and FE analysis of damage effects for rubber materials
Ms. Ai Kawasaki, Mechanical Design & Analysis Corporation
P2-01
13:30-14:00
Efforts to mold cooling analysis in hot stamping
Mr. Kentaro Nakamura, Y-tec corporation
P2-02
14:05-14:35
TBA
Mr. Takeshi Fujisawa, SYVEC CORPORATION
P2-03
14:40-15:10
Application of optical metrology for FEA
Mr. Yusuke Kawasaki, Marubeni Information Systems Co., Ltd.
15:10
|
15:20
Break
15:20
|
18:05
General Session 2
Kl-02
[Keynote Speech] 15:20-16:20
TBA
Dr. Nobuo Fukuwa, Nagoya University
JS-01
16:20-17:05
CAE, The State-of-Arts and the Future - LS-DYNA / JSTAMP for the next step
Mr. Takahiko Miyachi, JSOL Corporation
JS-02
17:05-18:05
Recent Development in LS-DYNA
Dr. John O. Hallquist, Livermore Software Technology Corporation
18:10
|
Gala Dinner
9:30
|
9:40
Poster session
10:00
|
11:45
Technical Session 1 Technical Session 2 Product
T1-01
10:00-10:45
The roadmap of automotive safety regulations and development plans of FE dummy and barrier models
Mr. Masahiro Okamura, JSOL Corporation
T1-02
11:00-11:45
LS-DYNA Plastic Material model
Mr. Toru Shimizu, JSOL Corporation
T2-01
10:00-10:45
JSTAMP/NV Tips
Mr. Yuji Kato, JSOL Corporation
T2-02
11:00-11:45
JSTAMP/NV Application and materia
Mr. Hiroshi Fukiharu, JSOL Corporation
PR-01
10:00-10:45
Introduction of Simpleware
Ms. Miki Miyazaki, JSOL Corporation
PR-02
11:00-11:45
CAE workspace Comet
Mr. Takanori Katsuta, JSOL Corporation
11:45
|
13:00
Lunch
13:00
|
17:45
Technical Session 1 Technical Session 2 Product
T1-03
13:00-13:45
Fatigue with LS-DYNA
Mr. Hidenori Nomura, JSOL Corporation
T1-04
14:00-14:45
Selection of explicit or implicit analysis
Mr. Masakazu Yanagisawa, JSOL Corporation
T1-05
15:00-15:45
Advanced use of the element in LS-DYNA
Mr. Norio Shimizu, JSOL Corporation
T1-06
16:00-16:45
LS-DYNA Fracture modeling
Mr. Kei Saito, JSOL Corporation
T1-07
17:00-17:45
Proposal of the efficient speed-up technique in LS-DYNA
Mr. Tetsuji Ida, JSOL Corporation
T2-03
13:00-13:45
Primer: 20 New and Useful Techniques for Fast and Efficient Working
Mr. Richard Taylor, Arup
T2-04
14:00-14:45
JFOLD - Introducing A New Simulation-Based Airbag Folding System for LS-DYNA
Mr. Shinya Hayashi, JSOL Corporation
T2-05
15:00-15:45
Incompressible CFD module Presentation
Mr. Inaki Caldichoury, Livermore Software Technology Corporation
T2-06
16:00-16:45
New Featues of LS-PrePost
Mr. Philip Ho, Livermore Software Technology Corporation
T2-07
17:00-17:45
Overview of frequency domain analysis in LS-DYNA
Mr. Yun Huang, Livermore Software Technology Corporation
PR-03
13:00-13:45
AFDEX
Mr. Makoto Yanagisawa, JSOL Corporation
PR-04
14:00-14:45
Welding Simulation
Mr. Masao Nakada, JSOL Corporation
PR-05
15:00-15:45
Efficient way of JVISION
Mr. Shinya Hiroi, JSOL Corporation
PR-06
16:00-16:45
Moldex3D
Mr. Toshiaki Hayashi, JSOL Corporation
PR-07
17:00-17:45
digimat
Mr. Toshiya Kano, JSOL Corporation
Training Seminars
10:00
|
17:00
TS-1
Incompressible CFD solver (ICFD) and FSI in LS-DYNA : Introduction and application
Mr. Inaki Caldichoury, Livermore Software Technology Corporation
TS-2
Frequency Domain Vibration, Acoustic and Durability Analysis with LS-DYNA
Mr. Yun Huang, Livermore Software Technology Corporation
TS-3
Introduction to LS-PrePost
Mr. Philip Ho, Livermore Software Technology Corporation

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Users Meeting Secretariat
JSOL Corporation, Engineering Technology Division

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