In electronics, precision equipment, semiconductors, and heavy electrical equipment, teams must balance miniaturization and higher power density with durability and energy efficiency, while also addressing lightweighting and drop durability for carbon‑neutral logistics.

Simulation technologies such as CAE, Computer Aided Engineering, enable thermal and thermo‑mechanical stress analyses, coupled thermal‑structural heat‑dissipation design, high‑frequency/EMC evaluations, and verification of wireless power transfer, WPT. For manufacturing and assembly, we support resin‑flow analyses for encapsulation/potting and optimization of cooling design. For advanced materials in semiconductors, batteries, 5G/6G, and displays, we enable data‑driven development through multi‑scale linkage from nano to micro and materials informatics (MI).

With over 40 years of experience and analysis expertise, we support you end‑to‑end—from design to operation.